Intelligent Solutions for Electronics

Precision Assembly
(Chip Placement & Packaging)

Problem

Manually assembling microcomponents, such as 0402 surface-mount packages, is a slow and error-prone process. Placement rates are typically capped at 500 - 800 components per hour, and hand tremors often result in misalignment greater than 0.05 mm. Advanced pick-and-place machines are prohibitively expensive, rendering them inaccessible for most small and medium-sized enterprises.

Solution

The Revopoint Vbot 9C, equipped with a precision vacuum nozzle, supports placement of ultra-small 01005 components at speeds of up to 1,200 placements per hour, with placement accuracy within ±0.03 mm. Its open API enables seamless integration with existing PLC systems, reducing overall equipment investment by up to 60% and making high-precision automation accessible to cost-sensitive manufacturers.

Micro Welding & Packaging

Problem

Manual alignment in FPC laser welding results in inconsistent heat-affected zones, limiting yield to approximately 85% and increasing the risk of damaging delicate circuits. Traditional welding machines struggle to adapt to various PCB types, such as HDI blind-via boards, resulting in inefficiencies and longer changeover times.

Solution

The Revopoint Vbot 9, equipped with a galvanometer laser head, uses real-time temperature feedback to adjust welding power, achieving yield rates of up to 98%. Its integrated vision positioning automatically detects solder points, facilitating quick changeovers in 10 minutes and enhancing production flexibility for various types of PCBs.

Quality Inspection & Testing

Problem

Manual inspection of PCB solder joints, such as ball grid arrays (BGAs), using magnifiers results in an 8% defect miss rate, often due to operator fatigue. Automated Optical Inspection systems can detect surface flaws but are unable to perform functional tests, such as verifying the integrity of high-frequency signals.

Solution

The Revopoint Vbot Series, equipped with 3D vision systems and a flying probe module, enables simultaneous visual inspection and electrical testing. It detects defects as small as 0.02 mm² while verifying circuit functionality, tripling inspection efficiency. An AI algorithm classifies defect types, such as cold solder joints, solder balls, and misalignments, and generates detailed digital inspection reports for traceability and analysis.

Flexible Material Handling

Problem

The manual handling of delicate materials, such as flexible printed circuits (FPCs) and thin displays, which are often thinner than 0.3 mm, commonly results in creasing, leading to scrap rates as high as 15%. Additionally, traditional suction-based grippers generate static electricity, which attracts dust and contaminates sensitive components.

Solution

The Vbot 9, paired with a biomimetic soft gripper, uses adaptive air pressure control to gently and precisely handle ultra-thin materials without leaving marks, reducing scrap rates to under 1%. An integrated ionizer neutralizes static and maintains ISO Class 5 cleanroom standards, ensuring safe operation in environments sensitive to contamination.

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Technical Support

  • Compatible Devices

    Revopoint 3D camera vision system

  • SDK Support

    SDK interface supports the rapid
    development of more applications

  • Download Center

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    hardware manual to help you start

Why Choose Us

  • Streamlining

    Workflow

  • Improved

    Production Efficiency

  • Safety

    and Stability

  • Superior

    Performance